Objectives:

• To highlight emerging applications, technologies and components for datacenter interconnects

Chairman:

• Ronny Henker, TU Dresden

Duration:

• 4h in total (including a break)

Schedule and Abstracts:

Click here to download the schedule and abstracts as a pdf.

Speakers:

• Niels Neumann, "Energy Efficiency Comparison of Optical and Electrical Interconnects for High-Performance Computing and Datacenters"
• Jean-Pierre Locquet, "Photonic Reservoir Computing"
• S. Lischke, "Monolithic photonic BiCMOS technology: Enabler for high-speed transceiver applications"
• Pascal Stark, "Novel III-V and Electro-Optic Components Co-Integrated with Silicon Photonics"
• J.J.G.M. (Jos) van der Tol, "Hybrid integration of photonics and electwithin your partnersronics using wafer scale polymeric"
• Benjamin Wohlfeil, "Photonic integrated circuits for data center interconnects"
• Alexandru Giuglea, "Comparison of Segmented and Traveling-Wave Electro-Optical Transmitters Based on Silicon Photonics Mach-Zehnder Modulators"
• Xi Zhang, "PAM-4 Electro-absorption modulator driver for 3D wafer scale packaging"
• N. Ledentsov Jr., "Future of high-speed VCSEL-based interconnects applying high order modulation formats"
• Theoni Alexoudi, "Mid-board Transceiver and Routing technologies for chip-to-chip optical interconnection"